FW-WX1035 138℃ Ultra-Low Temp Solder Paste-Guard Series
- No Solder Dispersion 不锡散
- No Residue 无残留
- Middle layer bonding of iPhone X~11, and for iPhone movable screen touch IC.
| Brand | FORWARD |
|---|---|
| Model | FW-WX1035 |
| Temperature | 138℃ Ultra-Low Temp |
| Gross weight | 50g |